Commercial femtosecond laser micro-nanomachining system designed for the material treatment in sub-micron and micron scale. The compact and flexible system can fit the diversity of R&D investigations and technology implementations in the fields of micro-opto-electronics, biotechnology, medicine industry, etc.
The custom design configuration and specifications can be fixed for the main application, however, the new ideas and the applications can be verified and developed by the same system with optional improvement or replacement. The system could make micro and nano-field progress more easy, speedy and less expensive.
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 Optical waveguidePhotonic crystal and optical memory
Inside machining into transparent material, marking
Mask repair
Precise metal mold
DNA chip, microchannel
Fuel cell material
Drilling, cutting, and hollow making for materials of various hardness
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 Less than 200 nm defect size
1D, 2D, 3D patterning with resolution better than 200 nmMachining or marking surface and inside
(for transparent materials: dielectrics, polymer, etc.)
Machining by dots (points) or continuous lines
Cutting, drilling
Shot number control (down to single with up to 250kHz frequencies)
Laser pulse energy and polarization control
Auto-focusing: Å}10nm RMS precision
Minimum heat affected zone (HAZ)
Machining in the atmosphere, inert gas purge, or vacuum condition
Real-time observation during machining (TV monitor)
1D-3D scan with confocal laser-microscope
Applicable to various materials (hard & soft)
Metal, semiconductors, dielectrics, compound materials, polymers, etc.
4 kinds of scanning ways are selectable.
1. Piezo actuator
2. Galvanic Mirror
3. Air bearing
4. Step motor
Multi points machining
Machining using laser interference (Hosono Labo. of TIT)
Optical system:
Microscope type, Bessel beam, singlet type, particular system, etc.
Software:
Original software (Option: 3D Max/ Auto-CAD, etc.)
Femtosecond laser already compatible:
λ= 800 nm, 1 kHz, 150 fs, 1 mJ/pulse
λ= 800 nm, 5 kHz, 150 fs, 0.5 mJ/pulse
λ= 800 nm, 250 kHz, 150 fs, 4 µJ/pulse
λ= 800 nm, 300 kHz, 150 fs, 3 µJ/pulse etc.
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High aspect ratio hole drilling using bessel beam
(Diameter 10 -15µm, Sample thick 1300µm, Aspect ratio About 1:125) |
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 |  Checked by Browser PDF File |
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| Femtosecond Laser Micro-nanomachining system |
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